74147 DATASHEET PDF

For a complete data sheet, please also download. The IC06 74HC/HCT/ HCU/HCMOS Logic Family Specifications The IC06 74HC/HCT/HCU/HCMOS. datasheet. SDLSB − OCTOBER − REVISED MAY D D ‘ , ‘LS Encode Line Decimal to 4-Line BCD Applications Include. SN datasheet, SN circuit, SN data sheet: TI – 10 LINE TO 4 LINE SN Download, SN Click to view. File Size, Kbytes.

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Not recommended for new designs. The information provided on this page represents TI’s knowledge and belief as of the date that it is provided. Phase relationships between inputs and outputs have been chosen arbitrarily for these examples. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used.

In no event shall TI’s liability arising out of such information exceed the total purchase price of the TI part s at issue in this document sold by TI to Customer on an annual basis. This must be considered when strobing the outputs. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.

Samples may or may not be available. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. The package thermal impedance is calculated in accordance with JESD Cascading circuitry enable input EI and enable output EO has been provided to allow octal expansion without the need for external circuitry.

Device is in production to support existing customers, but TI does not recommend using this part in a new design.

Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.

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Information of third parties may be subject to additional restrictions. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer’s risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.

Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof.

All diodes are 1N or equivalent. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. In some cases, TI components may be promoted specifically to facilitate safety-related applications. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

Efforts are underway to better integrate information from third parties. The implied decimal zero condition requires no input condition, as zero is encoded when all nine data lines are at a high logic level. This is the voltage between two emitters of a multiple-emitter transistor.

Products Applications Audio www. Voltage values, except inter-emitter voltage, are with respect to the network ground terminal.

TI’s terms “Lead-Free” or “Pb-Free” mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI.

Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free 741447. Product device recommended for new designs.

CL includes probe and jig capacitance. TI bases its knowledge and belief on information provided by third parties, and 7447 no representation or warranty as to the accuracy of such information.

74LS147 – 74LS147 10 to 4 Priority Encoder Datasheet

Except where mandated by applicable law, testing of all parameters of each component is not datashet performed. For all types, data inputs and outputs are active at the low logic level. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions.

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All input pulses are supplied by generators having the following characteristics: It’s a community-based project which helps to repair anything. Reproduction of significant portions of TI fatasheet in TI data books or data sheets is permissible only if reproduction is without alteration and is datashet by all associated warranties, conditions, limitations, and notices.

TI has discontinued the production of the device. Important Information and Disclaimer: Nonetheless, such components are subject to these terms.

Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Device has been announced but is not in production.

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Buyers are responsible for their products and applications vatasheet TI components. TI is not responsible or liable for such altered documentation. The outputs are measured one at a time, with one input transition per measurement. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

Buyer will fully indemnify TI and its representatives dwtasheet any damages arising out datasneet the use of any TI components in safety-critical applications. This component has a RoHS exemption for either datashedt lead-based flip-chip solder bumps used between the die and package, or 2 lead-based die adhesive used between the die and leadframe.

TI is not responsible or liable for any such statements. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.

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